InfiniLink develops a wide range of high-speed connectivity SerDes technologies on the most advanced process nodes

• DSP-based SerDes for Ethernet applications
• High-performance PCIe SerDes for HPC and AI applications
• Die-to-Die ultra-low-power UCIe SerDes for chiplets
• Long-reach ASA and A-PHY SerDes for Automotive applications

State-of-the-art Analog transceivers for optical applications, complementing our deep experience in high-speed electrical connectivity SerDes

• Proprietary technology delivers single chip multilane transceivers
• Integrates class-leading performance TIAs, equalizers, VGAs and optical modulator drivers
• Enabled by multiple novel background calibration algorithms to compensate for optical & electrical components non-idealities
• Delivers best-in-class solutions for the current generation 100G/λ Optics
• Enables next generation 200G/λ Optics with unmatched PPA metrics

• In-house, end-to-end, bit-accurate, modeling and simulation tools
• Patent pending photonics modulator architectures
• Patent pending integrated wavelength division multiplexers and demultiplexers
• High density fiber interfaces
• Compatible with both external laser sources (ELS) and internal laser sources (ILS) using hybrid integration
• Robust DFM methodology for a streamlined supply chain with worldclass foundries and OSATs

InfiniLink develops a wide range of high-speed connectivity SerDes technologies on the most advanced process nodes

• Photonics Chiplets offer a breakthrough in semiconductor technology, leveraging the advantages of electronics integration for optimized optical device design and scalable manufacturing.
• Following the "More than Moore" trend, enabling the combination of optics with traditional chips to alleviate I/O bottlenecks and provide significant power/cost savings.
• Co-packaged optics (CPO) integrate Photonics Chiplets directly with electrical chips, be it a network switch ASIC, a CPU, a GPU or an AI Hardware accelerator. This offers unmatched bandwidth density, reduced power consumption, and enables higher speeds where copper I/O falls short.
• The technology platform of tomorrow for HPC / AI is enabled by CPOs built using Advanced Packaging technologies such as high-density interposers, 3D die stacking and innovative Fiber attach solutions.